High quality solder paste for soldering SMD circuit components. The composition is 63% tin (Sn) and 37% lead (pb). Melting temparature is about 450 degree celsius. This soldering paste contains very fine particles of 25um-45um size to ensure maximum soldering quality and a colorless residue.
Specification:
Solder Paste
Alloy: Sn63/Pb37
